eMCP


eMMC

  • MLC NAND
  • General Features
    • Embedded with e-MMC Flash Controller and NAND flash
    • JEDEC○R eMMC 5.1 compliant
    • Field Firmware Update
    • Device Health Report
    • Secure Removal
    • Command Queuing
    • 1bit, 4bit, 8bit data bus widths
  • Supported Speed Mode
    • SDR52MHz/DDR52MHz/HS200/HS400
  • Form Factor
    • JEDEC○R MO-276D Embedded Flash
  • Memory
    • BGA 221 Ball BA type (11.5 x 13 mm)
  • Available Capacities
    • 8 GB
  • Voltages
    • Memory Power (VCC): 3.3V
    • Interface Power (VCCQ): 1.8V
  • ECC
    • Internal Error Correction
  • High Performance
    • HS400 (400 MB/s bus transfer rate)
  • Temperature Ranges
    • -25⁰ C ~+85⁰ C

LPDDR3 SDRAM

  • JEDEC LPDDR3 Compliant
    • Low Power Consumption
  • Signal Integrity
    • Configurable DS for System Compatibility
    • Configurable On-Die Termination
    • ZQ Calibration for DS/ODT Impedance Accuracy via External ZQ Pad(240Ω±1%)
  • Training for Signals Synchronization
    • DC Calibration Offering Specific DQ Output Patterns
    • CA Training
    • Write Leveling via MR Settings
  • Data Integrity
    • DRAM built-in Temperature Sensor for Temp. Compensated Self Refresh(TCSR)
    • Auto Refresh and Self Refresh Modes
  • Power-Saving Modes
    • Deep Power Down Mode (DPD)
    • Partial Array Self Refresh (PASR)
    • Clock Stop Capability during Idle Period
  • HSUL12 Interface and Power Supply
    • VDD1=1.70V to 1.95V
    • VDD2/VDDQ/VDDCA=1.14V to 1.3V
  • Programmable Functions
    • RON(34.3/40/48/60/80)/li>
    • RON(PD34.3_PU40/PD40_PU48/PD 34.3_PU48)
    • RTT(120/240)
    • RL/WL Select(Set A/Set B)
    • nWRE(nWR≦9/nWR>9)
    • PASR(bank/segment)
  • Speed Grade(DataRate/Read Latency)
  • 1600Mbps/RL=12

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